EB2532JA12-24.000M TR

EB2532 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Automotive Grade Quartz Crystal Resonator 2.5mm x 3.2mm x 0.8mm 4 Pad Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 8MHz to 66MHz Frequency Tolerance/Stability Aging at 25°C ±50ppm at 25°C, ±100ppm over -40°C to +85°C ±30ppm at 25°C, ±50ppm over -40°C to +85°C ±15ppm at 25°C, ±30ppm over -40°C to +85°C ±15ppm at 25°C, ±20ppm over -40°C to +85°C ±10ppm at 25°C, ±20ppm over -40°C to +85°C ±50ppm at 25°C, ±100ppm over -40°C to +105°C ±30ppm at 25°C, ±50ppm over -40°C to +105°C ±50ppm at 25°C, ±100ppm over -40°C to +125°C ±30ppm at 25°C, ±50ppm over -40°C to +125°C ±3ppm/year Maximum Load Capacitance Series Resonant, 7pF Parallel Resonant to 32pF Parallel Resonant Shunt Capacitance 3pF Maximum Equivalent Series Resistance Mode of Operation 800 Ohms Maximum over Nominal Frequency of 8MHz to 9.999999MHz 250 Ohms Maximum over Nominal Frequency of 10MHz to 10.999999MHz 150 Ohms Maximum over Nominal Frequency of 11MHz to 11.999999MHz 100 Ohms Maximum over Nominal Frequency of 12MHz to 12.999999MHz 80 Ohms Maximum over Nominal Frequency of 13MHz to 15.999999MHz 70 Ohms Maximum over Nominal Frequency of 16MHz to 20.999999MHz 60 Ohms Maximum over Nominal Frequency of 21MHz to 29.999999MHz 50 Ohms Maximum over Nominal Frequency of 30MHz to 66MHz AT-Cut Fundamental Drive Level 200µWatts Maximum Crystal Cut AT-Cut Spurious Response Measured from Fo to Fo +5000ppm -3dB Minimum -50°C to +150°C Storage Temperature Range Insulation Resistance Measured at 100Vdc 500 Megaohms Minimum Revised B: 12/03/2021 Page 1 of 6 www.ecliptek.com EB2532 Series PART NUMBERING GUIDE ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A Revised B: 12/03/2021 Page 2 of 6 www.ecliptek.com EB2532 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN 1 CONNECTION Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground All Tolerances are ±0.1 All Dimensions in Millimeters Revised B: 12/03/2021 Page 3 of 6 www.ecliptek.com EB2532 Series TAPE & REEL DIMENSIONS Quantity per Reel: 3,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised B: 12/03/2021 Page 4 of 6 www.ecliptek.com EB2532 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (ts MIN) Ramp-up Rate (TL to TP) 150°C 175°C 200°C 60 - 180 Seconds Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 217°C 60 - 150 Seconds Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 3°C/Second Maximum 260°C Maximum for 10 Seconds Maximum High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised B: 12/03/2021 Page 5 of 6 www.ecliptek.com EB2532 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) N/A 150°C N/A 30 - 60 Seconds Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 150°C 200 Seconds Maximum Target Peak Temperature(TP Target) 245°C Maximum 2 Times/230˚C Maximum 1Time Time within 5°C of actual peak (tP) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 5°C/Second Maximum 245°C Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised B: 12/03/2021 Page 6 of 6 www.ecliptek.com